UNICOM Engineering and ZutaCore form strategic OEM agreement to deliver warrantied HyperCooled AI servers globally

UNICOM Engineering and ZutaCore form strategic OEM agreement to deliver warrantied HyperCooled AI servers globally

ZutaCore, a leading provider of direct-to-chip, waterless liquid cooling solutions, has unveiled a strategic partnership with UNICOM Engineering, a Dell Titanium OEM Partner and leading system integrator.

UNICOM Engineering provides server-based application platforms and lifecycle support services for software technology developers, data centre infrastructure, OEMs and enterprises worldwide, underscoring this collaboration’s global reach and impact.

This partnership marks a crucial move in embedding ZutaCore’s HyperCool into leading servers worldwide, starting with Dell Technologies XE9680 with NVIDIA H100 and H200 GPUs, ensuring global enterprise support and warranties for data centres at scale.

ZutaCore also announced that a global Artificial Intelligence-as-a-Service (AIaaS) provider leader has chosen the ZutaCore-equipped Dell Technologies XE9680 servers as the premier platform to launch its cutting-edge AI services. This landmark selection underscores the exceptional efficiency and reliability of ZutaCore’s HyperCool technology, especially for high-density computing needs that AI workloads demand.

The AIaaS provider will have in-production deployments starting Q3 2024, setting a new standard for AI computing in terms of performance and sustainability.

HyperCool technology is a true innovation in the industry. It’s one of the only two-phase direct-to-chip, dielectric cooling solutions with in-production deployments. This technology has been proven to cool the most powerful processors of 2,800 watts or more and currently for 120kW per rack of computing power, while also increasing rack processing density by 300%.

“This partnership is a significant milestone for driving ZutaCore’s waterless, direct-to-chip liquid cooling into the volume market globally,” said Erez Freibach, Co-founder and CEO, ZutaCore. “The future of AI hinges on the ability to deliver the performance of the next-generation GPUs, while also adhering to strong sustainable practices within the data centre.

“This is where ZutaCore sets itself apart from any other cooling solution with its ability to cool the hottest processors with no water used and little to no modifications to current real estate, power, or cooling systems,” added Freibach.

“Leveraging UNICOM Engineering’s technical expertise, global footprint and established relationships with the industry’s leading silicon manufacturers and server OEMs, specifically Dell Technologies, data centre clients and partners can be assured the highest standards are being met for the integration of the ZutaCore HyperCool technology,” said Rusty Cone, General Manager, UNICOM. 

“This, along with a full fledge of warranty and uplifted services, globally, will enable the realisation of a sustainable AI infrastructure capable of supporting a wide range of applications that require even the most demanding workloads and processing power,” added Cone.

The proven cooling power of HyperCool

Featuring a ground-breaking closed-loop system that operates at low pressure and moves large amounts of heat off the processors and away from the servers, ZutaCore’s HyperCool can be implemented in new or existing data centres to deliver 10x more computing power, a 50% reduction in Total Cost of Ownership, 100% heat re-use and reduced CO2 emissions for a sustainable data.

There is also a growing ecosystem of servers certified to work with HyperCool, including industry powerhouses such as Dell Technologies, ASUS, Pegatron and SuperMicro. 

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