Vertiv MegaMod CoolChip solution integrates best-in-class technologies to deliver turnkey AI critical digital infrastructure up to 50% faster than onsite build.
Vertiv has launched the Vertiv MegaMod CoolChip – a liquid cooling-equipped prefabricated modular (PFM) data center solution.
The solution can be configured to support the platforms of leading AI compute providers and scaled to customer requirements. By bringing together the quality and process efficiency enabled by offsite fabrication with best-in-class AI-ready technologies, MegaMod CoolChip boasts reduced deployment time for AI critical digital infrastructure – by up to 50%.
Building on Vertiv’s experience developing other prefabricated modular data centers, MegaMod CoolChip is designed to address the specific requirements of AI compute through a turnkey solution that integrates Vertiv CoolChip technology to support direct-to-chip liquid cooling, high-efficiency power protection and distribution and other critical digital infrastructure technologies.
The solution is available globally and can be used as a modular retrofit of an existing facility or as a new freestanding data center, supporting up to hundreds of kilowatts per row, up to multiple megawatts with prefabricated units.
Viktor Petik, Vice President, Vertiv infrastructure Solutions, said: “The addition of this solution to our portfolio provides more flexibility to successfully accelerate AI.”
Demand for prefabricated modular and micro data center solutions has been accelerated by AI, with Vertiv being cited as a global leader.
Vertiv engineers have applied successful learnings around prefabricated solutions and the needs of AI deployments to the development of Vertiv MegaMod CoolChip solutions.
Key features of the solution include:
- High-density compute: MegaMod CoolChip supports IT systems from the customer’s chosen AI compute provider, including accelerated computing platforms, integrated into equipment racks with integrated plumbing and high-density Vertiv rack power distribution units (rPDUs).
- High-density liquid cooling infrastructure: Vertiv chillers and cooling distribution units (CDUs) provide safe and efficient management of cooling fluids to and from the rack. MegaMod CoolChip uses direct-to-chip cooling for high-power CPUs and GPUs by managing heat removal from components not serviced by the direct-to-chip cold plates. The balance between liquid and air cooling is tailored to the design of the AI compute platform to optimize efficiency.
- High-efficiency power protection and distribution: Vertiv power technologies provide power protection and distribution from the utility to the rack, including busway, switchgear and compatibility with the high-efficiency Vertiv Trinergy uninterruptible power supply (UPS) and the Vertiv PowerNexus solution.
- Modular assembly: MegaMod CoolChip arrives in prefabricated units, including the building enclosure and all building systems, that are assembled on site. It is also available in skid-mounted units, providing flexibility options for new builds, retrofits and expansions.
- Single-source accountability: From initial consultation through configuration, fabrication, installation, commissioning, and lifecycle services, Vertiv manages all aspects of solution development.
By employing advanced technologies, such as direct-to-chip liquid cooling and the Vertiv power infrastructure, MegaMod CoolChip data centers can improve Power Usage Effectiveness (PUE) compared to data centers using traditional technologies – resulting in a lower carbon footprint.
