Hyve Solutions, a wholly owned subsidiary of TD SYNNEX, and a leading provider of hyperscale digital infrastructures, has announced the integration of Intel Xeon 6 processors into Hyve-designed motherboards and systems.
This collaboration with Intel marks a significant step forward in meeting the diverse performance and efficiency requirements of modern computing environments, from high-performance AI applications to exceptional efficiency and cloud scalability.
Hyve Solutions is working with its customers to embrace the latest in Intel’s technology leadership, bringing cutting-edge advancements directly to their operations. Intel Xeon 6 is now a core component of the Hyve-designed HS9124 motherboard and are utilised in systems tailored for Deep Learning and High-Performance Computing (HPC) applications.
“Intel Xeon 6 delivers unparalleled performance and scalability, making them ideal for a wide range of applications, from HPC to AI, storage and networking,” said Steve Ichinaga, President, Hyve Solutions. “They also enable data centre consolidation, reducing space and power requirements.”
Intel Xeon 6 processors feature two unique microarchitectures, delivering high performance and power efficiency across the widest range of workloads. Intel Xeon processors with E-cores are optimised to deliver efficiency in cloud native workloads.
While Intel Xeon processors with P-cores are optimised for parallel processing of multiple data elements, thereby ensuring exceptional performance in traditional data centre workloads. Hyve has announced products supporting Intel Xeon 6 processors with E-cores, with offering of P-core solutions in the future.
“Intel and Hyve Solutions share a similar commitment to innovation and technology leadership,” said Justin Hotard, Executive Vice President and General Manager, Data Center and AI Group at Intel. “Our most recent collaboration centred around Intel Xeon 6 processors focuses on enabling customers to maximise their investments and their system efficiency when targeting the latest HPC, AI and cloud-native workloads.”
Intel Xeon 6 processors feature the fastest DDR5 memory, including Multiplexed Combined Rank DIMMs (MCR DIMMs), for maximum throughput. The flexibility of Intel Xeon 6 is evident in the range of SKUs available, offering up to 144 cores and eight memory channels for high overall performance integrated into Hyve’s solutions.
As a fully vertical integrated original design manufacturer with SMT operations based in the US, Hyve utilises its extensive design and manufacturing expertise, along with its global footprint, to swiftly and efficiently deploy AI data centre architectures. Hyve’s on-going relationship with Intel underscores its dedication to providing scalable AI data centre architectures that evolve with customer needs, pushing the boundaries of what’s achievable in AI innovation.
